JPH0639464Y2 - 発光ダイオード - Google Patents

発光ダイオード

Info

Publication number
JPH0639464Y2
JPH0639464Y2 JP1988063522U JP6352288U JPH0639464Y2 JP H0639464 Y2 JPH0639464 Y2 JP H0639464Y2 JP 1988063522 U JP1988063522 U JP 1988063522U JP 6352288 U JP6352288 U JP 6352288U JP H0639464 Y2 JPH0639464 Y2 JP H0639464Y2
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
recess
infrared light
diode chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988063522U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01167065U (en]
Inventor
秀之 池上
元 樫田
弘文 進藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1988063522U priority Critical patent/JPH0639464Y2/ja
Publication of JPH01167065U publication Critical patent/JPH01167065U/ja
Application granted granted Critical
Publication of JPH0639464Y2 publication Critical patent/JPH0639464Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP1988063522U 1988-05-13 1988-05-13 発光ダイオード Expired - Lifetime JPH0639464Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988063522U JPH0639464Y2 (ja) 1988-05-13 1988-05-13 発光ダイオード

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988063522U JPH0639464Y2 (ja) 1988-05-13 1988-05-13 発光ダイオード

Publications (2)

Publication Number Publication Date
JPH01167065U JPH01167065U (en]) 1989-11-22
JPH0639464Y2 true JPH0639464Y2 (ja) 1994-10-12

Family

ID=31289018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988063522U Expired - Lifetime JPH0639464Y2 (ja) 1988-05-13 1988-05-13 発光ダイオード

Country Status (1)

Country Link
JP (1) JPH0639464Y2 (en])

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6945672B2 (en) * 2002-08-30 2005-09-20 Gelcore Llc LED planar light source and low-profile headlight constructed therewith
US7425083B2 (en) * 2005-05-02 2008-09-16 Samsung Electro-Mechanics Co., Ltd. Light emitting device package
JP5441316B2 (ja) * 2007-04-05 2014-03-12 ローム株式会社 半導体発光装置
JP2013229395A (ja) * 2012-04-24 2013-11-07 Panasonic Corp Ｌｅｄパッケージおよびｌｅｄ発光素子
DE102013100121B4 (de) * 2013-01-08 2025-08-14 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5577874U (en]) * 1978-11-21 1980-05-29
JPS58220480A (ja) * 1982-06-16 1983-12-22 Toshiba Corp 光半導体装置
JPS59115669U (ja) * 1983-01-25 1984-08-04 三洋電機株式会社 発光素子

Also Published As

Publication number Publication date
JPH01167065U (en]) 1989-11-22

Similar Documents

Publication Publication Date Title
JP4182783B2 (ja) Ｌｅｄパッケージ
JP3753011B2 (ja) 反射型発光ダイオード
JP3312049B2 (ja) 半導体発光装置
JP4254276B2 (ja) 発光装置およびその製造方法
CN106025028B (zh) 倒装发光二极管芯片及其制作方法
JPH0224389B2 (en])
JP2004281606A (ja) 発光装置およびその製造方法
JPH0918058A (ja) 発光半導体装置
JP2002353497A (ja) 発光素子
JP6574768B2 (ja) 内部高屈折率ピラーを有するｌｅｄドーム
JPH0639464Y2 (ja) 発光ダイオード
JP3238326B2 (ja) 発光装置
JP2003017756A (ja) 発光ダイオード
JP2004088007A (ja) 発光ダイオード
JPH0410671A (ja) 発光ダイオード
KR20040024747A (ko) 고휘도 발광다이오드 및 그 제조방법
JPH0645656A (ja) 発光装置及びそれを備えた光ファイバ式光電センサ
JPH0550754U (ja) 発光装置
JP2784537B2 (ja) 発光ダイオードの製造方法
CN207116475U (zh) 一种红外辐射led发光元件
JP2007142289A (ja) 発光装置
JPS6273786A (ja) 半導体発光装置
JP2007081063A (ja) 発光装置
KR100779120B1 (ko) 측면 발광 다이오드 패키지
JPS60182781A (ja) 半導体装置